In the manufacturing process of automobile tires, molds are very important mechanical equipment. The quality of the mold directly affects the quality of the tire. The surface of the tire mold will have carved patterns or other patterns, and the mold is often used in high temperature and high humidity environments, so there will be a lot of rubber or other residues remaining in the grooves of the inner carving. After a certain degree, it will affect the shape and structure of the mold and eventually lead to defective products. Therefore, it is particularly important to keep the tire mold clean.
With the continuous development of science and technology, tire mold cleaning technology is constantly being updated. The earliest method is to use high temperature alkaline water to soak the tire mold, which is very useful for small molds, but not suitable for large molds.
Principles and advantages of laser cleaning tire molds
ZJ-CM500-LC tire mold Laser cleaning machine using the characteristics of laser high energy, high brightness, good directionality, etc., to destroy the force between the pollutants and the surface of the object, so as to remove the pollutants without damaging the substrate.
Specifications(For reference only)
Laser Power | 500W |
Laser wavelength | 1064nm |
Pulse width(ns) | 130-160 |
Pulse repetition frequency(KHZ) | 20-50 |
Max Single Pulse Energy(MJ) | 25 |
Laser source type | Fiber laser source |
Working Humidity | <70% |
Working Temperature | 5-40°C |
Power Supply | 1PH / 220V±10% / 50-60HZ / 25A |
Power Consumption | 4500W |
Size | 1080 x 710 x 1170mm |
Net Weight | 230KG |
Cooling Way | Water cooling |
Laser Type | Pulse |
Length of fiber cable(m) | 10 (Option) |
Laser cleaning tire mold is a process of selective evaporation of dirt on the surface of the laser cleaning material. Different materials have different absorption rates of laser energy with specific wavelengths. When the absorption rate of the attachment on the surface of the material is greater than the absorption rate of the substrate, the temperature of the attachment can be instantly raised above the melting point and vaporized by laser irradiation. The resulting surface layer interface vaporization phenomenon does not damage the substrate because it does not reach the melting point of the substrate.
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