For advanced semiconductor device manufacturing, each after a process, the surface of the silicon wafer will be more or less the presence of particulate contaminants, metal residues or organic residues, etc., the device feature size of the ever-shrinking and three-dimensional device structure of the increasing complexity of the semiconductor device on the particulate contamination, the impurity concentration and number of more and more sensitive.
On the silicon wafer mask on the surface of the pollution particles of the cleaning technology puts forward higher requirements, the key point is to overcome the pollution of micro-particles and the substrate between the great adsorption, many semiconductor manufacturers of the current cleaning methods are acid washing, manual wiping, not to mention the efficiency of the slow, but also produces secondary pollution. What kind of cleaning method is more suitable for cleaning semiconductor products? Laser cleaning is currently more suitable for a way, when the laser scanning the past, the material surface dirt are removed, and for the gap in the dirt can be easily removed, will not scratch the surface of the material, and will not produce secondary pollution, is an assured choice.
With the integrated circuit device size continues to shrink, the cleaning process of material loss and surface roughness has become a must concern, the particles will be removed without material loss and graphic damage is the most basic requirements, laser cleaning technology has non-contact, no thermal effect, will not produce surface damage to the object to be cleaned, and will not produce secondary contamination of the traditional cleaning methods can not be compared to the advantages of the solution to the It is the best cleaning method to solve the pollution of semiconductor devices.
